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- Legacy part 12292
- 20 g Bottle
- Adhesive Designed for Printed Circuit Board Assembly and Repair
- Cures Instantly w/Tak Pak® Accelerator
description
- For printed circuit board assembly and repair. Cures instantly with Loctite® 712™ or 7452™ Tak Pak® Accelerator.
applications
- Mount stand-offs, edge guides and stiffeners to circuit boards
- Designed for printed circuit board assembly and repair
features
- Cures instantly with Loctite® 7452™ Tak Pak® Accelerator
- Replaces epoxies, silicones, hot melts for mounting components, reinforcing stand-offs, wire tacking and board repair
- Tamper-proof adjustable components
- CARB: Complies with VOC regulations as detailed by the California Air Resource Board
- OTC: Complies with VOC regulations as detailed by the Ozone Transport Commission
compliances
- Commercial Item Standard A-A-3097 Type II, Class 3
| Type | 444 |
| Gap Fill (Diametral) | 0.007 in |
| Viscosity (cP) | 700 |
| Appearance Clarity | Clear |
| Temperature Range [Min] | -65 °F |
| Container Type | Bottle |
| Shear Strength (Steel/Steel) | 3200 psi |
| Container Size | 20 g |
| Temperature Range [Max] | 180 °F |
| Cure Speed Full (Steel) | 24 h |
| Color | Clear |
| Cure Speed Fixture | 30 sec |
| Application | Wire Tacking |
| Use With | General Purpose Ethyl |
| Weight | 0.08 LB |
| EAN or UPC | 79340122925 |
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